Principles of Microengineering - ELE00070H

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Module summary

The module aims to provide students with a basic understanding of the science, design, fabrication and characterisation of devices and systems manufactured on the micrometre scale and the use of these devices across a range of application areas.

Module will run

Occurrence	Teaching period
A	Autumn Term 2022-23

Module aims

Subject content aims:

• To introduce the students to the basic concepts of the science, design, fabrication and characterisation of devices and systems manufactured at the micrometre scale;

• To provide the students the basic understanding and knowledge to use these devices across a range of applications.

Graduate skills aims:

• To develop skills in the selection and application of appropriate numeric and algebraic techniques.

Module learning outcomes

Subject content learning outcomes

After successful completion of this module, students will be able to:

• Understand and apply scaling laws that underpin mechanics and dynamics of microengineered devices.

• Describe the conventional materials and fabrication processes employed for manufacturing of microdevices.

• Describe the key metrology techniques employed for the characterisation of microengineered devices and systems.

• Understand a wide range of commercial microengineered devices and systems and their applications.

Graduate skills learning outcomes

After successful completion of this module, students will be able to:

• Explain and evaluate advanced technical concepts concisely and accurately

• Select, adapt and apply a range of mathematical techniques to solve advanced problems

• Demonstrate skills in problem solving, critical analysis and applied mathematics

Module content

Introduction to microengineering including definitions and historic perspective.

• Introduction to scaling laws; mechanics and dynamics at the micrometre scale; and basic transistor level circuits (e.g., inverters).

• Materials for microdevice fabrication inc., silicon, silicon on insulator (SOI), thin film silicon, dielectrics (high K and low K), metals and magnetic thin film materials.

• Introduction to microfabrication: inc., silicon wafer technology, lithography, thin film deposition (CVD and PVD techniques), wet and dry etching

• Fundamentals of device characterisation: inc., optical microscopy, scanning and transmission electron microscopy, optical spectroscopy, ellipsometry, x-ray spectroscopy, nano-indentation, scanning probe techniques.

• Principles and applications of microengineered systems inc., mechanical transducers (e.g. inertial sensors), timing references, micro-fluidics, energy harvesters, diodes/photodiodes, TFT devices.

Indicative assessment

Task	% of module mark
Essay/coursework	75
Essay/coursework	12.5
Essay/coursework	12.5

Special assessment rules

None

Indicative reassessment

Task	% of module mark
Essay/coursework	100

Module feedback

Formative feedback:

Emails to the Module Coordinator with Questions / Comments will be answered as soon as possible.

Questions can also be submitted at any time via the Question Box on the module Wiki page.

The students can have technical discussions with the module Coordinator during open office hours.

Summative feedback:

Two sets of tutorial questions will be handed out on Week 5 and 8. Feedback on these tutorial questions, with comments on how the students can improve on their work, will be available to the students typically within 5-10 working days after submission.

Feedback on final reports will be available to the students within 25 working days.

Indicative reading

Fundamentals of Microfabrication and Nanotechnology, Marc J. Madou, Taylor & Francis, 3rd Edition, 2011

Microsystem Design, Stephan D. Senturia, Springer, 2000

Practical MEMS: Design of microsystems, accelerometers, gyroscopes, RF MEMS, optical MEMS, and microfluidic systems, Ville Kaajakari, Small Gear Publishing, 2009