Accessibility statement


Acquired in 2018, the FEI Nova 200 is a focused ion beam scanning electron microscope (FIBSEM) or DualBeam™ instrument. It is used for cutting & milling with the gallium ion beam using ion sputtering. The (Sirion™) electron column is equipped with a Schottky (field-assisted) thermionic emitter and operates between 2 and 30 keV; the liquid metal (gallium) ion source operates between 5 and 30 keV and sits in a (Magnum™) ion column with octupole electrostatic lens.

This instrument is equipped with:

  • Everhart-Thornley detector for backscattered electrons (SEM only) and secondary electrons (FIB and SEM). The (magnetic) field-free SEM imaging condition allows accurate ion milling.
  • Through-the-lens detector for high-resolution SE imaging (SEM only).
  • Kleindiek 3-axis micro-manipulator for lift-out specimen preparation for, e.g. TEM lamella preparation.
  • Pt deposition gas injection system (GIS) for masking, contacting and hole-filling.
  • XeF 2 GIS for enhanced Si etching (7× increase).
  • 5-axis eucentric stage with the following ranges:
    - X,Y = +/- 50 mm
    - Z = 25 mm
    - Tilt = -15 o to +75 o (at +52 o ion column is normal to stage)
    - Rotation = 360 o
  • Ion probe range: 1 pA (7 nm diameter) to 20 nA (430 nm)

The instrument is used for TEM lamella preparation and manufacturing near-nanometre sized holes for plasmonic devices.

Please contact the Director (Dr Steve Tear) or the Experimental Officer (Dr Jonathan Barnard) for further details about access. You can also email

Example Applications

Step-by-step procedure for TEM lamella preparation. The identification and extraction of magnetic devices for examination in the TEM (see JEOL 2010 for bright-field image). Extraction and milling is about 5 to 6 hours per sample.

An array of holes on Au-SiN membranes cut for electron interferometry experiments. Each slot is 500 nm wide.

Mounting a lamella onto an OmniProbe™ grid (left) with the Kleindiek micro-manipulator.